Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Title:
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author:
Liu, Yong. author.
ISBN:
9781461410539
Personal Author:
Edition:
1st ed. 2012.
Physical Description:
XVIII, 594 p. online resource.
Added Corporate Author:

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E-Book 139716-1001 TK1001 -1841
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